Hi-MO 5

Smart Soldering
Uniform smart soldering increases the power and efficiency of the module, and improves the power load capacity.

Optimized Module Size
Large-format modules with M10 wafer size use dual-glass and frame packaging to ensure module strength.

Smart Module Packaging and Logistics
Smart module packaging solutions are used to achieve high reliability, low-cost transportation and logistics.

Optimized Electrical Parameters
The working current is about 13A, which is perfectly adapted to mainstream string inverters.

Gallium-doped Technology
Gallium-doped technology overcomes LID degradation and guarantees the long-term power generation of the module.

Bifacial Energy Yield
Additional power generation from the backside of bifacial modules increases the overall energy yield, which has been verified by customers and third-party testing organizations.